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Material information press release about share exchange between IET and EZconn Corporation.
2025.12.04
1.Date of occurrence of the event:2025/12/04
2.Company name:EZconn Corporation.
3.Relationship to the Company (please enter ”head office” or
”subsidiaries”):head office
4.Reciprocal shareholding ratios:NA
5.Cause of occurrence:
EZconn convened the Audit Committee and the Board meeting today
to approve a Share Exchange by Issuing New Shares Through a Capital
Increase as Consideration for Acquiring the Newly Issued Shares of IET.
6.Countermeasures:
EZconn held a press conference to explain the material information
regarding this matter at 8:00 PM on December 4, 2025, at TWSE.
7.Any other matters that need to be specified (the information disclosure
also meets the requirements of Article 7, subparagraph 9 of the Securities
and Exchange Act Enforcement Rules, which brings forth a significant impact
on shareholders rights or the price of the securities on public companies.):
EZconn Corporation (TWSE: 6442, the ”Company” or ”EZconn”) and
IntelliEPI Inc. (Cayman) (TPEx: 4971, a non-related party to the
Company, ”IET”) today (December 4, 2025) each convened their respective
Board meetings and approved a strategic share exchange to deepen
long-term cooperation between the two companies. Under the approved
structure, both EZconn and IET will subscribe to newly issued shares of
the counterparty through capital increases. The agreed exchange ratio
is 1 EZconn common shares for 5.1 IET common shares. Upon completion
of the share exchange, EZconn will hold approximately 15.26% of IET's
total common shares, and IET will hold approximately 1.79% of EZconn's
total common shares.
EZconn is a global manufacturer specializing in optical active and
passive components and high-frequency RF connectors. Its products are
widely deployed in data centers, 5G communications, low-earth-orbit (LEO)
satellites, telecom base stations, aerospace and defense, and biomedical
testing. In recent years, EZconn has actively expanded its technology
layout and development efforts in silicon photonics and Co-Packaged Optics
(CPO).
IET focuses on the research, development, and production of III–V
compound semiconductor epitaxial wafers, utilizing proprietary Molecular
Beam Epitaxy (MBE) technology. Its product lineup—including InP, GaAs,
and GaSb epitaxial wafers—is widely applied in high-speed optical
communications, wireless communications, defense sensing, and quantum
computing.
This share-exchange alliance marks a significant milestone for EZconn,
representing a strategic extension of its position in the optical
communications value chain—from components and modules upstream into
critical semiconductor materials. Through vertical integration, the two
companies aim to accelerate deployment in next-generation, AI-driven
data-center high-speed transmission markets.
As AI servers and hyperscale data centers transition from 400G to 800G,
1.6T, and even 3.2T, demand for high-speed optical transceivers and
optical modules continues to grow rapidly.
IET is one of only two global epitaxial wafer manufacturers capable of
producing high-quality MBE wafers. Its InP-based HBT (heterojunction
bipolar transistor), PIN photodiode, and APD (avalanche photodiode)
epitaxy platforms are critical materials for high-speed optical
communications.
By forming a strategic alliance with IET, EZconn will gain access to
upstream key epitaxial materials, strengthening supply-chain stability
for high-performance optical components and ensuring secure access to
the epitaxial wafers required for next-generation high-speed
transmission. This will enhance EZconn's overall competitiveness and
reinforce long-term industry barriers to entry.
With the rapid emergence of silicon photonics (SiPh) and photonic
integrated circuits (PICs), EZconn Group is actively developing
external laser source modules for CPO architectures. CPO systems
require high-quality compound semiconductors as light sources.
IET provides industry-leading InP and VCSEL (vertical-cavity
surface-emitting laser) epitaxial wafer technology. Its MBE process
offers exceptional precision and controllability in epitaxial layer
thickness and doping concentration—making it a preferred choice for
high-performance CPO light sources.
The complementary strengths of EZconn and IET enable the joint
development of integrated CPO solutions, accelerating time-to-market
and strengthening both companies' positions in next-generation CPO
applications.
EZconn has appointed Taishin Securities' Capital Markets Division as
the exclusive financial advisor for this share exchange. Taishin
Securities assisted with strategic planning, structural evaluation,
and transaction execution. Following completion of the share
exchange, EZconn and IET will establish a long-term, strategic
partnership designed to leverage their respective competitive
advantages, enhance operational performance, and create long-term
shareholder value.
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